Intel Core i3-6100TE processor 2.7 GHz 4 MB Smart Cache
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Intel Core i3-6100TE. Processor family: Intel® Core™ i3, Processor socket: LGA 1151 (Socket H4), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 64 GB, Memory types supported by processor: DDR4-SDRAM,DDR3L-SDRAM. On-board graphics adapter model: Intel® HD Graphics 530, Maximum on-board graphics adapter memory: 64 GB, On-board graphics adapter outputs supported: Embedded DisplayPort (eDP),DisplayPort,HDMI,DVI. Market segment: Embedded, PCI Express configurations: 1x16,2x8,1x8+2x4, Supported instruction sets: SSE4.1,SSE4.2,AVX 2.0. Processor package size: 37.5 x 37.5 mm
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Specifications
Manufacturer | INTEL |
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Product type | Processors |
Technical details
Processor cache | 4096 KB |
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Product type | Processor |
Supported memory types | DDR4-SDRAM,DDR3L-SDRAM |
Maximum graphics card memory | 64 GB |
Bus bandwidth | 8 |
Bus type units | GT/s |
Launch date | Q4'15 |
Maximum resolution & refresh rate (DisplayPort) | 4096x2304@60Hz |
Maximum resolution & refresh rate (HDMI) | 4096x2304@24Hz |
Maximum resolution & refresh rate (Integrated Flat Panel) | 4096x2304@60Hz |
Maximum resolution & refresh rate (VGA) | N/A |
Status | Launched |
Maximum memory | 64 GB |
Processor brand name | Intel Core i3Intel Core i3 Processor |
Last change | 63903513 |
Maximum resolution (WiDi) | 1080p |
Product family | 6th Generation Intel Core i3 Processors |
Bus speed | 8 GT/s |
Processor ID | 0x1912 |
Processor
Processor family | Intel® Core™ i3 |
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Processor cores | 2 |
Processor socket | LGA 1151 (Socket H4) |
Processor lithography | 14 nm |
Box | N |
Cooler included | N |
Processor manufacturer | Intel |
Processor model | i3-6100TE |
Processor base frequency | 2.7 GHz |
Processor operating modes | 64-bit |
Processor generation | 6th gen Intel® Core™ i3 |
Component for | PC |
Processor series | Intel Core i3-6100 Desktop series |
Processor threads | 4 |
System bus rate | 8 GT/s |
Processor cache | 4 MB |
Processor cache type | Smart Cache |
Thermal Design Power (TDP) | 35 W |
Compatible chipsets | Intel® B150, Intel® H110, Intel® H170, Intel Q150, Intel® Q170, Intel® Z170 |
Stepping | R0 |
Bus type | DMI3 |
Memory bandwidth supported by processor (max) | 34.1 GB/s |
Processor codename | Skylake |
Processor code | SR2LS |
Processor ARK ID | 88181 |
Generation | 6th Generation |
Memory
Memory channels | Dual-channel |
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Maximum internal memory supported by processor | 64 GB |
Memory types supported by processor | DDR4-SDRAM,DDR3L-SDRAM |
Memory clock speeds supported by processor | 1333,1600,1866,2133 MHz |
Memory voltage supported by processor | 1.35 V |
ECC | Y |
Weight & dimensions
Processor package size | 37.5 x 37.5 mm |
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Other features
Maximum internal memory | 64 GB |
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Maximum internal memory | 65536 MB |
Video decoding | Y |
Graphics output | eDP/DP/HDMI/DVI |
Graphics
On-board graphics card | Y |
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On-board graphics card model | Intel® HD Graphics 530 |
Maximum on-board graphics card memory | 64 GB |
On-board graphics card outputs supported | Embedded DisplayPort (eDP),DisplayPort,HDMI,DVI |
On-board graphics card base frequency | 350 MHz |
On-board graphics card dynamic frequency (max) | 1000 MHz |
Number of displays supported (on-board graphics) | 3 |
On-board graphics card 4K support | Y |
On-board graphics card DirectX version | 12.0 |
On-board graphics card OpenGL version | 4.5 |
On-board graphics card maximum resolution (DisplayPort) | 4096 x 2304 pixels |
On-board graphics card maximum resolution (eDP - Integrated Flat Panel) | 4096 x 2304 pixels |
On-board graphics card maximum resolution (HDMI) | 4096 x 2304 pixels |
On-board graphics card refresh rate at maximum resolution (DisplayPort) | 60 Hz |
On-board graphics card refresh rate at maximum resolution (eDP - Integrated Flat Panel) | 60 Hz |
On-board graphics card refresh rate at maximum resolution (HDMI) | 24 Hz |
On-board graphics card ID | 0x1912 |
Processor special features
Intel® Hyper Threading Technology (Intel® HT Technology) | Y |
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Intel® Identity Protection Technology (Intel® IPT) | Y |
Intel® Turbo Boost Technology | N |
Intel® Quick Sync Video Technology | Y |
Intel® InTru™ 3D Technology | Y |
Intel® Wireless Display (Intel® WiDi) | Y |
Intel® Clear Video HD Technology (Intel® CVT HD) | Y |
Intel® Insider™ | Y |
Intel® AES New Instructions (Intel® AES-NI) | Y |
Enhanced Intel SpeedStep Technology | Y |
Intel Trusted Execution Technology | N |
Intel® Memory Protection Extensions (Intel® MPX) | Y |
Intel® Transactional Synchronization Extensions | N |
Intel Enhanced Halt State | Y |
Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID) | Y |
Intel VT-x with Extended Page Tables (EPT) | Y |
Intel® Secure Key | Y |
Intel TSX-NI | N |
Intel Stable Image Platform Program (SIPP) | N |
Intel® OS Guard | Y |
Intel® Small Business Advantage (Intel® SBA) | Y |
Intel Clear Video Technology | Y |
Intel Software Guard Extensions (Intel SGX) | Y |
Intel 64 | Y |
Intel Identity Protection Technology version | 1.00 |
Intel Secure Key Technology version | 1.00 |
Intel Small Business Advantage (SBA) version | 1.00 |
Intel Stable Image Platform Program (SIPP) version | 0.00 |
Intel Virtualization Technology (VT-x) | Y |
Intel Virtualization Technology for Directed I/O (VT-d) | Y |
Intel TSX-NI version | 0.00 |
Conflict-Free processor | Y |
Intel® Boot Guard | Y |
Intel® vPro™ Platform Eligibility | N |
Features
Execute Disable Bit | Y |
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Idle States | Y |
Thermal Monitoring Technologies | Y |
Market segment | Embedded |
Maximum number of PCI Express lanes | 16 |
PCI Express slots version | 3.0 |
PCI Express configurations | 1x16,2x8,1x8+2x4 |
Supported instruction sets | SSE4.1,SSE4.2,AVX 2.0 |
Scalability | 1S |
CPU configuration (max) | 1 |
Embedded options available | Y |
Graphics & IMC lithography | 14 nm |
Thermal solution specification | PCG 2015A |
PCI Express CEM revision | 3.0 |
Harmonized System (HS) code | 8542310001 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G077159 |